1. <3D> IC stacking technology
Author:
Library: Library of Urmia University of Technology (West Azarbaijan)
Subject: Three-dimensional integrated circuits,Microelectronic packaging,TECHNOLOGY & ENGINEERING / Electronics / Semiconductors, bisacsh
Classification :
TK
,
7874
.
893
,.
A14
,
2011
2. Failure-Free Integratea Circuit Packages. Systematic Elimination of Failures through Reliability Engineering, Failure Analysis,and Material Improvements
Author:
Library: Library of Razi Metallurgical Research Center (Tehran)
Subject: ، Microelectronic packaging,، Integrated circuits -- Fault tolerance
Classification :
TK
7870
.
15
.
F353
2005
3. Failure-free integrated circuit packages: systematic elimination of failures through reliability engineering, failure analysis, and mat erial improvements
Author:
Library: Central Library of Sharif University of Technology (Tehran)
Subject: ، Microelectronic packaging,، Integrated circuits-- Fault tolerance
Classification :
TK
7870
.
15
.
F353
2005
4. Fundamentals of microfabrication
Author: Marc J. Madou
Library: Central Library and Document Center of Shahid Madani University of Azarbayjan (East Azarbaijan)
Subject: Microelectronics,Integrated circuits- Design and construction,Microelectromechanical systems- Design and construction,Machining,Microelectronic packaging,Lasers- Industrial applications
Classification :
TK
,
7836
,.
M33
5. Fundamentals of microfabrication: the science of miniaturization
Author: Madou, Marc J.
Library: Central Library of Sharif University of Technology (Tehran)
Subject: ، Microelectronics,، Integrated circuits-- Design and construction,، Microelectromechanical systems-- Design and construction,، Machining,، Microelectronic packaging,، Lasers-- Industrial applications
Classification :
TK
7836
.
M33
2002
6. Microelectronics interconnection and packaging
Author: / edited by Jerry Lyman
Library: Tehran University, technical faculty libraries 1 (Tehran)
Subject: Integrated circuits,Microelectronic packaging
Classification :
TK
7874
.
M483
7. Microelectronics interconnection and packaging
Author: edited by jerry Lyman, editor Packaging & production, Electronics
Library: Central Library and Information Center of Ferdowsi University of Mashhad (Khorasan Razavi)
Subject: ، Integrated circuits,، Microelectronic packaging
Classification :
TK
7874
.
M483
8. Microelectronics interconnection and packaging
Author: edited by Jerry Lyman
Library: Central Library and Documentation Center (Kerman)
Subject: ، Integrated circuits,، Microelectronic packaging
Classification :
TK
7874
.
M5
9. Microelectronics interconnection and packaging
Author: edited by Jerry Lyman
Library: Central Library and Documents Center of Industrial University of Khaje Nasiredin Toosi (Tehran)
Subject: ، Integrated circuits,، Microelectronic packaging
Classification :
TK
7874
.
M483
10. Multichip module technologies and alternatives
Author: / edited by Daryl Ann Doane, Paul D. Franzon
Library: Library of Campus2 Colleges of Engineering of Tehran University (Tehran)
Subject: Microelectronic packaging,Integrated circuits - Very large scale integration - Design and construction
Classification :
TK
7874
.
M864
1993
11. Multichip module technology handbook
Author: Garrou, Philip E
Library: Central Library of Sharif University of Technology (Tehran)
Subject: ، Multichip modules )Microelectronics(,، Microelectronic packaging,، Integrated circuits-- Very large scale integration-- Design and construction
Classification :
TK
7874
.
G372
1998
12. Proceedings of the 1986 International Symposium on Microelectronics October 6-8 1986, Georgia/Sponsored
Author:
Library: Central Library of Sharif University of Technology (Tehran)
Subject: Congresses ، Microelectronics,Congresses ، Hybrid integrated circuits,Congresses ، Microelectronic packaging
Classification :
TK
7874
.
I59237
1986
13. The simulation of thermomechanically induced stress in plastic encapsulated IC packages
Author: Kelly, Gerard
Library: Central Library of Sharif University of Technology (Tehran)
Subject: ، Microelectronic packaging,، Integrated circuits-- Materials-- Stress corrosion,، Electronic apparatus and appliances-- Plastic embedment,، Integrated circuits-- Materials-- Thermomechanical properties
Classification :
TK
7874
.
K413
1999
